High Voltage Generator

The circuit serves to generate high-frequency high-voltage fields in the surface coating. At the same time, it was necessary to deal with comparatively high currents as well as the requirements regarding air and creepage distances as well as the small space available. The signal processing took place impedance-controlled. With base materials of highest CTI values (≥600) in connection with Wirelaid all this could be realized. Pleasant side effect: a cheaper PCB with a simpler structure compared to conventional approaches.

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» Perfection is finally attained not when there is no longer anything to add but when there is no longer anything to take away. «
— Antoine de Sainte-Exupéry, French aviator and writer (1900-1944)

NEWS

High Voltage Generator

The circuit serves to generate high-frequency high-voltage fields in the surface coating. At the same time, it was necessary to deal with comparatively high currents as well as the requirements regarding air and creepage distances as well as the small space available. The signal processing took place impedance-controlled. With base materials of highest CTI values (≥600) in connection with Wirelaid all this could be realized. Pleasant side effect: a cheaper PCB with a simpler structure compared to conventional approaches.

3D camera backplane for In-Flight refueling systems

In avionics environment, highest system reliability is generally required. High robustness and mechanical stability at the lowest possible PCB weight, are properties which normally excepts each other. Wirelaid shows its strength exactly at this point. Implementation of the necessary current load, at less or equal than 40A, in a backplane with minimum use of copper and board area finally fulfilled all this requirements perfectly. Used in most modern In-Flight Refueling aircrafts of the world market, Wirelaid also shows that it is not only limited and beneficial at highest currents and power.
The project was honoured with the Award for Project Excellence.

DC-AC Bridge Converter with Phase Currents up to 400Amps

The challenges of this circuit brought WIRELAID again in new dimensions. The power and thermal management could only be integrated in a relatively small, already fixed in advance, round, housing space. The allowable temperature increases during operation were furthermore kept within narrow limits. And for such applications, extremely low number of used copper layers, the combination of power and signals in each of the outer layers, an optimum heat transfer could be achieved through the PCB. The required parameters were clearly achieved even at full load of 400A.

TECHNOLOGY

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PRODUCTS

  • THINK AROUND THE CORNER - WIRELAID 3D

    In the WIRELAID 3D PCB is milled perpendicular to the inserted wires a straight groove, z-axis controlled. In this groove, the circuit board can be bent up to 135 °. Due to the current tracks directly through the kink, expensive and partly error-prone plug connections are now redundant.

    In the application, WIRELAID is a comparable approach to the 3D rigid-flex / Semi-Flex technology. For applications with only 1-2 required bending cycles, however, show large differences. No minimum bending radius, no additional materials or area milling, yields significant cost advantages.

    Using the WIRELAID 3D technology can be e.g. also provide completely closed systems from a single circuit board.

  • HIGH CURRENTS - WIRELAID POWER

    Bring high and very high currents to the PCB - this trend is unmistakable. Combining this with small line-space ratios, smallest components and low circuit volume is usually goal of the hardware engineers.

    Wirelaid Power provides its technical potential right here. Within the PCB, partial additional cross sections are placed by use of flat wires. In this way the necessary high current paths were realized easily and efficiently.

    Usage of Wirelaid creates additional routing area, reduces the number of layers and / or the copper-base foil thickness, in each case. The result is a technically equivalent product at a lower cost.

  • WIRELAID SHUNT

    In the printed circuit board integrated Current Sense Resistors replace the discrete component. The otherwise customary in Wirelaid copper flat wires are replaced by flat wires of resistance wire with a very low temperature coefficient.

    The result is a fully integrated resistor which is tunable during the manufacturing process, with a low-resistance for indirect measurement of currents in the conductor path.

    External mounting and its logistics repeals, more routing area is free and the shunt doesn’t change its value by external influences.

  • WIRELAID POWERFLEX

    Powerflex is a semi-flexible standard application that is combined with Wirelaid. The Semiflex feature remains, but extends around the property of the high-current capability up to 100A, especially in the bending area.

    The decisive advantage comes from combining conventionally etched structures, such as for data lines, and Wirelaid tracks for power supply or drivers.

    Additional mechanical stability through the flat wires in the bending area increases safety during installation and operation.

USAGE

  • Energy Recovery Control Module

    Specific values:

    Current max. effective: 87A, Peak (10s) 150A

    Maximum temperature rise: ΔT: + 40 K

    Ambient temperature: app. 25°C

    Conventional device:

    Thick copper

    Number of PCB: 1

    Number of layers: 6, @ 2 x 400µm inner layers and 4 x 35µm remaining layers

    Results with WIRELAID Power:

    Reduction of base copper thickness to 105µm at power planes

    No special technologies necessary

    Temperature rise in operation with Wirelaid max.: 25K

    Adjustment of the mounting and welding lines is not required.

    Less copper amount

    Significantly cheaper production

    View wire layer
  • Line Filter for Power Supply

    Specific values:

    Current max. effective: 33A

    Maximum temperature rise: ΔT: + 20 K

    Ambient temperature: 25°C

    New developed device:

    WIRELAID PCB

    Number of PCB: 1

    Number of layers: 4, @ 4 x 70µm,

    wires at only one outer layer

    Results with WIRELAID Power:

    Reduction of base copper thickness to 70µm

    Avoid of 105μm solution with the same area

    Temperature rise in operation with Wirelaid max.: 20K

    Only few wires necessary

    Increase of the device output power at a constant size.

    Very cost-effective production

    View wire layer
  • SMT MOS FET Regulator

    Specific values:

    Current max. effective: 80A

    Maximum temperature rise: ΔT: + 20 K

    Ambient temperature: app.50°C

    New developed device:

    WIRELAID PCB

    Number of PCB: 1

    Number of layers: 6, @ 4 x 105µm inner layers and 2 x 70µm  outer layers

    Results with WIRELAID Power:

    Reduction of base copper thickness to 70µm

    Reduction of layers from 6 to 4, WIRELAID at both outer layers.

    Temperature rise in operation with Wirelaid max.: <20K

    Small total area

    Complete SMD compatible outer layers in combination with Easy EMS

    View wire layer
  • DC Hub Speed Control Module

    Specific values:

    Current max. effective: 30A, 350W

    Maximum temperature rise: ΔT + 30 K

    Ambient temperature: max. 100°C

    Old device:

    Conventional PCB, Area 40 x 50 mm2

    Number of PCB: 1

    Number of layers: 6, @ 4 x 105µm inner layers and 2 x 35µm outer layers

    Request: increase the output to 600W, 50A with the same size

    Results with WIRELAID Power:

    Reduction of base copper thickness, 5µm outer, 70µm inner layers

    Reduction of layers from 6 to 4, WIRELAID at both inner layers.

    Temperature rise in operation with Wirelaid max.: 25K

    Constant PCB area!

    Redoubled power dissipation

    Cheaper PCB with higher power output

    View wire layer
  • Current distributor with I-Sense

    Specific values:

    Current max. effective: total 120A

    Maximum temperature rise: ΔT: + 30 K

    Ambient temperature: app.80°C

    New developed device:

    WIRELAID PCB

    Number of PCB: 1

    Number of layers: 4, @ 2 x 105µm inner layers and 2 x 70µm outer layers

    Results with WIRELAID Power:

    Reduction of base copper thickness to 70µm in the inner layers

    Reduction of layers from 6 to 4, WIRELAID at both inner layers.

    Temperature rise in operation with Wirelaid max.: 25K

    Use of Power Elements as Pressfits

    View wire layer
  • Power Supply for AC Servo

    Specific values:

    Current max. effective: 65A

    Maximum temperature rise: ΔT: + 20 K

    Ambient temperature: app. 25°C

    Original device:

    Multilayer Stackup

    Number of PCB: 1

    Number of layers: 8, @ 4 x 105µm inner layers and 4 x 70µm remaining layers

    Results with WIRELAID Power:

    Reduction of base copper thickness, to 70µm

    Reduction of layers from 8 to 4, WIRELAID at one inner layer.

    Temperature rise in operation with Wirelaid max.: 20K

    Saving of 2 complete cores

    Only some critical nets need to be reinforced with wires

    PCB layout and assembly remains unchanged.

    View wire layer
  • High Current Power Distribution PCB

    Specific values:

    Current max. effective: 120A

    Maximum temperature rise: ΔT: + 20 K

    Ambient temperature: up to 100°C

    New developed device:

    WIRELAID PCB

    Number of PCB: 1

    Number of layers: 6, @ 6 x 105µm

    Results with WIRELAID Power:

    Reduction of base copper thickness, to 70µm

    Reduction of layers from 6 to 4, WIRELAID at both inner layers.

    Temperature rise in operation with Wirelaid max.: 20K

    Combination with solderless Power Pressfit  Elements

    Increase of the device output power at a constant size.

    PCB manufacturing at lower price level

    Lower PCB area

    View wire layer
  • Secondary Power Module

    Specific values:

    Current max. effective: 200A, peak (5s) 250A

    Maximum temperature rise: ΔT: + 35 K

    Ambient temperature: app. 60°C

    Previous device:

    Conventional thick copper stackup

    Number of PCB: 1

    Number of layers: 6, @ 4 x 210 µm inner layers and 2 x 70µm outer layers

    Results with WIRELAID Power:

    Reduction of base copper thickness, to 70µm

    Reduction of layers from 6 to 4, WIRELAID at both inner layers.

    Temperature rise in operation with Wirelaid max.: 20K

    Strongly improved soldering conditions

    No new housing necessary (railway: existing device box!)

    View wire layer
  • Multiphase Torque Control Module

    Specific values:

    Current max. effective: 120A

    Maximum temperature rise: ΔT: + 30 K

    Ambient temperature: app.80°C

    New developed device:

    WIRELAID PCB

    Number of PCB: 1

    Number of layers: 6, @ 4 x 105µm inner layers and 2 x 70µm outer layers

    Results with WIRELAID Power:

    Reduction of base copper thickness, to 70µm

    Reduction of layers from 6 to 4, WIRELAID at solder and component layer.

    Temperature rise in operation with Wirelaid max.: 25K

    Adjustment of the mounting and welding lines is not required.

    Increase of the device output power at a constant size.

    More power at same size of device.

    PCB layout and assembly remains unchanged.

    View wire layer
  • Fully Electronic Car Steering

    Specific values:

    Current load I eff: 75A, Peak (1s): 120A

    Maximum temperature rise: 15K

    Ambient temperarture range: - 40°C to +85°C

    New developed device:

    Wirelaid PCB

    Number of PCB: 1

    Number of layers / Cu thickness: 4 x 70µm

    Results with WIRELAID Power:

    Replacement of a thick copper design 6 x 105µm, thereby smaller line / space ratio

    Easier manufacturing and lower copper amount

    Saving of a complete core, means 2 layers

    Power- and control electronic on one single PCB fully integrated.

    Combination with powerelements in presfit technology.

    View wire layer
  • Pitch Control Module Wind Turbine

    Specific values:

    Current max. effective: 75A, Peak (10s): 150A

    Maximum temperature rise: ΔT: + 40 K

    Ambient temperature: 0 - 30°C

    New developed device:

    WIRELAID PCB

    Number of PCB: 1

    Number of layers: 6, @ 2 x 400µm inner layers and 4 x 105µm remaining layers

     

    Results with WIRELAID Power:

    Reduction of base copper thickness, all layers 35µm

    Reduction of layers from 6 to 4, WIRELAID at inner layers.

    Temperature rise maximum at rated current, max.: 25K

    Adjustment of the mounting and welding lines is not required.

    Increase of the device output power at a constant size.

    No changes to the mechanical components such as housings and heatsinks.

    PCB layout and assembly remains unchanged.

    View wire layer
  • AC Servocontroller

    Specific values:

    Current max. effective: 50A

    Maximum temperature rise: ΔT: + 30 K

    Ambient temperature: app.55°C

    Conventional  device:

    Multilayer, Cable strands with solder joints, hand soldering

    Number of PCB: 2

    Number of layers: 4, @ 4 x 70µm

    Results with WIRELAID Power:

    Integration of both PCBs to one

    Complete integration of control systems and power equipment at the bending edge

    Avoid of hand soldering

    Assembly of both PCBs together possible

    Strong cost reduction

    PCB layout and assembly remains nearly unchanged.

    View wire layer
  • Switch Carrier Unit

    Specific values:

    Current max. effective: 12A

    Maximum temperature rise: ΔT: + 30 K

    Ambient temperature: app.25°C

    New developed device:

    WIRELAID PCB

    Number of PCB: 1

    Number of layers: 4, @ 4 x 35µm

    Results with WIRELAID Power

    Out of 3 single PCBs Wirelaid made only one

    Simple handling, EMS and assembly

    No separate PCB connectors to use

    Cost reduction about 20%

    View wire layer
  • Dynamic vehicle door sill trims Lighting

    Specific values:

    Device with complete µP controller and wireless connection

    Flattest construction necessary PCB height 0,8mm

    LEDs are perpendicular to the vertical assembly

     

    Old device:

    Flexjumper solution

    Number of PCB: 2

    Number of layers: 4, @ 4 x 35µm

    Results with WIRELAID 3d:

    Extremely low construction possible, only slightly higher than the LED components

    LED signals are transmitted exclusively through wires

    Only one single PCB

    Easy handling and assembly

    View wire layer
  • LED Helix Light

    Specific values:

    Complicated geometrical arrangement of RGB Led

    Microcontroller on the PCB  in fine pitch

    New developed device:

    WIRELAID PCB

    Number of PCB: 1

    Number of Layers/Cu thickness: 4 x 35µm

    Results with Wirelaid 3D:

    All the individual elements of the LED carrier with Wirelaid 3d connected

    No  PCB connector, plug or similar elements

    Helix structure by slightly bending, stable at the depth milling and easy to reach

    Simple LP handling, assembly and Stack up

    View wire layer
  • IGBT Module with Wireless Connection

    Specific values:

    Current max. effective: 40A

    Maximum temperature rise: ΔT: + 25 K

    Ambient temperature: RT

    New developed device:

    WIRELAID PCB

    Number of PCB: 1

    Number of layers: 6, @ 4 x 70µm inner layers and 2 x 35µm outer layers

    Results with WIRELAID Power:

    Stack up unchanged

    Separate antenna module is integrated on the PCB border with Wirelaid 3d

    Only one PCB

    Much easier logistics and assembly

    No PCB connecting elements

    Cost reduction about 20%

    View wire layer
  • Amplifier for Servomotor

    Specific values:

    Current max. effective: 50A (@ 100% duty cycle)

    Maximum temperature rise: ΔT: + 20 K

    Ambient temperature: 0°C - 40°C

    New devloped device:

    WIRELAID PCB

    Number of PCB: 1

    Number of layers 4

    Base copper thickness 4 x 70µm

     

    Results with WIRELAID 3D:

    Increase of device output power from 5,5kW to 7,5kW at constant size of housing.

    Advantages in manufacturing and costs by eliminating a 2 PCBs and all connectors.

    Power-, interface-, and control electronics on one single PCB without any connectors.

    View wire layer
  • Amplifier for Servo Motor Driver

    Specific values:

    Effecitve current: 12A

    Maximum temperature rise: 10K

    Temperature working environment: 0° C up to 40° C

    New developed device:

    Application in WIRELAID

    Only one PCB

    Number of layers: 4

    Base copper thickness: 70µm

    Results with WIRELAID 3D & Power:

    Substitution of a stamp grid solution in bending edge area.

    Easier production and lower costs by integrating on a PCB and saving a connector or punch grid.

    Power- and control electronic on one single PCB fully integrated.

    Saving PCB routing area by Wirelaid Power at the bottom side.

     

    View wire layer

TEAM

  • +49 9126 2959 15
    Harald Ruscher

    Software & Layout Support

  • +49 9126 2959 12
    Michael Sauer

    Technology & Development

  • +49 9126 2959 10
    Markus Wölfel

    CEO

  • +49 9126 2959 21
    Jürgen Westenkirchner

    Electronics, Development & Technical sales

  • +49 9126 2959 23
    Jürgen Hofmann

    Quality & Production

CONTACT

Wirelaid PCB is a development of JUMATECH GmbH. Technology and uses are protected by patents.

CONTACT

Tel.: +49 (0) 9126 2959 - 10
Fax: +49 (0) 9126 2659 - 18

E-Mail: info@jumatech.com

ADDRESS

JUMATECH GmbH
Naabstraße 4
90542 Eckental
Deutschland

IMPRINT

INFORMATION IN ACCORDANCE WITH § 5 OF THE GERMAN TELESERVICES ACT (TELEMEDIENGESETZ, TMG))

JUMATECH GmbH

Naabstraße 4
90542 Eckental
Germany

MANAGEMENT

Markus Wölfel
Tel.: +49 (0) 9126 2959 - 10
Fax: +49 (0) 9126 2959 - 18
E-Mail: info@jumatech.com

REGISTER ENTRY

Register number: HRB 10474
Tax ID: 216/129/9023
Tax office Erlangen, Germany

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